Parameters | |
---|---|
Mfr | Seeed Technology Co., Ltd |
Series | - |
Package | Bulk |
Product Status | Active |
Kit Type | Starter Kit |
Main Purpose | Inventor Kit |
Interconnect System | Grove |
Suggested Programming Environment | - |
Utilized IC / Part | - |
Included MCU/MPU Board(s) | - |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
ECCN | EAR99 |
HTSUS | 8537.10.9170 |
Other Names | 1597-110020229 |
Standard Package | 1 |