
| Parameters | |
|---|---|
| Mfr | Laird Technologies EMI |
| Series | SMD Grounding Metallized |
| Package | Tape & Reel (TR) |
| Product Status | Active |
| Type | Film Over Foam |
| Shape | Hourglass |
| Width | 0.197" (5.00mm) |
| Length | 0.197" (5.00mm) |
| Height | 0.197" (5.00mm) |
| Material | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| Plating | - |
| Plating - Thickness | - |
| Attachment Method | Solder |
| Operating Temperature | -40°C ~ 70°C |
| Shelf Life Start | - |
| Shelf Life | 24 Months |
| Storage/Refrigeration Temperature | - |
| RoHS Status | RoHS Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| ECCN | EAR99 |
| HTSUS | 8536.90.4000 |
| Standard Package | 1,000 |