Parameters | |
---|---|
Mfr | Seeed Technology Co., Ltd |
Series | uArm |
Package | Bulk |
Product Status | Obsolete |
Configuration | Arm |
Utilized IC / Part | ATmega2560 |
Interconnect System | - |
Suggested Programming Environment | - |
Included MCU/MPU Board(s) | - |
Contents | Bluetooth Module, Components, Hardware, uArm(s) |
Moisture Sensitivity Level (MSL) | Not Applicable |
ECCN | EAR99 |
HTSUS | 8479.50.0000 |
Standard Package | 1 |