Parameters | |
---|---|
Mfr | Chip Quik Inc. |
Series | SMD2 |
Package | Bulk |
Product Status | Active |
Type | Solder Sphere |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.030" (0.76mm) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Flux Type | - |
Wire Gauge | - |
Process | Lead Free |
Form | Jar |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | - |
Digi-Key Storage | - |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | Not Applicable |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 8311.30.3000 |
Standard Package | 1 |
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