Parameters |
Mfr |
Chip Quik Inc. |
Series |
SMD2 |
Package |
Bulk |
Product Status |
Active |
Type |
Solder Sphere |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter |
0.030" (0.76mm) |
Melting Point |
423 ~ 428°F (217 ~ 220°C) |
Flux Type |
- |
Wire Gauge |
- |
Process |
Lead Free |
Form |
Jar |
Shelf Life |
24 Months |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
- |
Digi-Key Storage |
- |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
Not Applicable |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8311.30.3000 |
Standard Package |
1 |
Lead Free Solder Sphere Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar