Parameters | |
---|---|
Mfr | Harimatec Inc. |
Series | HF250DP |
Package | Bulk |
Product Status | Obsolete |
Type | Solder Paste |
Composition | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) |
Diameter | - |
Melting Point | 423°F (217°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | - |
Process | Lead Free |
Form | Cartridge, 0.88 oz (25g) |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Digi-Key Storage | - |
Shipping Info | - |
RoHS Status | RoHS Compliant |
Moisture Sensitivity Level (MSL) | Not Applicable |
ECCN | EAR99 |
HTSUS | 8311.90.0000 |
Standard Package | 10 |
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