Parameters |
Mfr |
Harimatec Inc. |
Series |
HF250DP |
Package |
Bulk |
Product Status |
Obsolete |
Type |
Solder Paste |
Composition |
Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) |
Diameter |
- |
Melting Point |
423°F (217°C) |
Flux Type |
No-Clean |
Wire Gauge |
- |
Mesh Type |
- |
Process |
Lead Free |
Form |
Cartridge, 0.88 oz (25g) |
Shelf Life |
- |
Shelf Life Start |
- |
Storage/Refrigeration Temperature |
- |
Digi-Key Storage |
- |
Shipping Info |
- |
RoHS Status |
RoHS Compliant |
Moisture Sensitivity Level (MSL) |
Not Applicable |
ECCN |
EAR99 |
HTSUS |
8311.90.0000 |
Standard Package |
10 |
Lead Free No-Clean Solder Paste Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) Cartridge, 0.88 oz (25g)