Parameters |
Contact Termination |
Solder |
Contact Material |
Copper Alloy |
Contact Finish |
Gold |
Contact Finish Thickness |
31.5µin (0.80µm) |
Termination Finish |
Gold |
Termination Finish Thickness |
7.87µin (0.200µm) |
Contact Size |
- |
Features |
- |
Base Product Number |
173114 |
Moisture Sensitivity Level (MSL) |
Not Applicable |
ECCN |
EAR99 |
HTSUS |
8536.90.4000 |
Standard Package |
1 |
Mfr |
Molex |
Series |
FMP, FCT 173114 |
Package |
Bulk |
Product Status |
Active |
Type |
Power |
Contact Type |
Male Pin |
Contact Form |
- |
Wire Gauge |
12-16 AWG |
D-Sub Contact Male Pin Gold 12-16 AWG Solder