| Parameters |
| Mfr |
Chip Quik Inc. |
| Series |
SMD |
| Package |
Bulk |
| Product Status |
Active |
| Type |
Wire Solder |
| Composition |
Bi57Sn42Ag1 (57/42/1) |
| Diameter |
0.040" (1.02mm) |
| Melting Point |
280°F (138°C) |
| Flux Type |
No-Clean, Rosin Activated (RA) |
| Wire Gauge |
18 AWG, 19 SWG |
| Process |
Lead Free |
| Form |
Spool, 1.8 oz (50g) |
| Shelf Life |
- |
| Shelf Life Start |
- |
| Storage/Refrigeration Temperature |
- |
| Base Product Number |
SMDSW |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
Not Applicable |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8311.30.6000 |
| Standard Package |
1 |
Lead Free No-Clean, Rosin Activated (RA) Wire Solder Bi57Sn42Ag1 (57/42/1) 18 AWG, 19 SWG Spool, 1.8 oz (50g)