Parameters |
Mfr |
Chip Quik Inc. |
Series |
- |
Package |
Bulk |
Product Status |
Active |
Type |
Wire Solder |
Composition |
Sn63Pb37 (63/37) |
Diameter |
0.031" (0.79mm) |
Melting Point |
361°F (183°C) |
Flux Type |
No-Clean, Water Soluble |
Wire Gauge |
20 AWG, 22 SWG |
Process |
Leaded |
Form |
Spool, 8 oz (227g), 1/2 lb |
Shelf Life |
- |
Shelf Life Start |
- |
Storage/Refrigeration Temperature |
- |
Digi-Key Storage |
- |
Shipping Info |
- |
Base Product Number |
SMDSW |
RoHS Status |
RoHS non-compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Affected |
ECCN |
EAR99 |
HTSUS |
8311.30.3000 |
Standard Package |
1 |
Leaded No-Clean, Water Soluble Wire Solder Sn63Pb37 (63/37) 20 AWG, 22 SWG Spool, 8 oz (227g), 1/2 lb