Parameters | |
---|---|
Mfr | Chip Quik Inc. |
Series | - |
Package | Bulk |
Product Status | Active |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | 4 |
Process | Lead Free |
Form | Jar, 1.76 oz (50g) |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
Shipping Info | - |
Base Product Number | TS391S |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | Not Applicable |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 3810.10.0000 |
Standard Package | 1 |
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