Chip Quik Inc. TS391SNL250
THERMALLY STABLE SOLDER PASTE NO
- Manufacturer: Chip Quik Inc.
- Manufacturer's number: Chip Quik Inc. TS391SNL250
- Package: Bulk
- Datasheet: PDF
- Stock: 1050
- SKU: TS391SNL250
- Pricing:we created an exceptionally flexible and competitive pricing policy.
| Parameters | |
|---|---|
| Mfr | Chip Quik Inc. |
| Series | - |
| Package | Bulk |
| Product Status | Active |
| Type | Solder Paste |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter | - |
| Melting Point | 423 ~ 428°F (217 ~ 220°C) |
| Flux Type | No-Clean |
| Wire Gauge | - |
| Mesh Type | 4 |
| Process | Lead Free |
| Form | Jar, 8.8 oz (250g) |
| Shelf Life | 12 Months |
| Shelf Life Start | Date of Manufacture |
| Storage/Refrigeration Temperature | 68°F ~ 77°F (20°C ~ 25°C) |
| Shipping Info | - |
| Base Product Number | TS391S |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 3810.10.0000 |
| Standard Package | 1 |
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)
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