Chip Quik Inc. TS391SNL250

THERMALLY STABLE SOLDER PASTE NO

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Unit Price: $69.9500

Ext Price: $69.9500

Details

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

Parameters
Mfr	Chip Quik Inc.
Series	-
Package	Bulk
Product Status	Active
Type	Solder Paste
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	-
Melting Point	423 ~ 428°F (217 ~ 220°C)
Flux Type	No-Clean
Wire Gauge	-
Mesh Type	4
Process	Lead Free
Form	Jar, 8.8 oz (250g)
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	68°F ~ 77°F (20°C ~ 25°C)
Shipping Info	-
Base Product Number	TS391S
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	Not Applicable
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	3810.10.0000
Standard Package	1