| Parameters |
| Mfr |
t-Global Technology |
| Series |
PH3n |
| Package |
Box |
| Product Status |
Obsolete |
| Type |
Heat Spreader |
| Package Cooled |
Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method |
Adhesive |
| Shape |
Square |
| Length |
3.937" (100.00mm) |
| Width |
3.937" (100.00mm) |
| Diameter |
- |
| Fin Height |
0.003" (0.07mm) |
| Power Dissipation @ Temperature Rise |
- |
| Thermal Resistance @ Forced Air Flow |
- |
| Thermal Resistance @ Natural |
- |
| Material |
Copper |
| Material Finish |
Polyester |
| Shelf Life |
12 Months |
| Base Product Number |
PH3N-100 |
| RoHS Status |
RoHS Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| ECCN |
EAR99 |
| HTSUS |
7410.21.6000 |
| Other Names |
DK01471 |
| Standard Package |
1 |
Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader