Parameters | |
---|---|
Mfr | Laird Technologies - Thermal Materials |
Series | Tflex™ HD7.5 |
Package | Box |
Product Status | Active |
Usage | - |
Type | Gap Filler Pad, Sheet |
Shape | Square |
Outline | 457.20mm x 457.20mm |
Thickness | 0.100" (2.54mm) |
Material | Silicone, Ceramic Filled |
Adhesive | - |
Backing, Carrier | - |
Color | Gray |
Thermal Resistivity | - |
Thermal Conductivity | 7.5W/m-K |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Digi-Key Storage | - |
Moisture Sensitivity Level (MSL) | Not Applicable |
Other Names | 926-A18443-10 |
Standard Package | 1 |