| Parameters |
| Mfr |
Chip Quik Inc. |
| Series |
- |
| Package |
Bulk |
| Product Status |
Active |
| Type |
Solder Paste |
| Composition |
Sn63Pb37 (63/37) |
| Diameter |
- |
| Melting Point |
361°F (183°C) |
| Flux Type |
No-Clean |
| Wire Gauge |
- |
| Mesh Type |
4 |
| Process |
Leaded |
| Form |
Jar, 1.76 oz (50g) |
| Shelf Life |
12 Months |
| Shelf Life Start |
Date of Manufacture |
| Storage/Refrigeration Temperature |
68°F ~ 77°F (20°C ~ 25°C) |
| Shipping Info |
- |
| Base Product Number |
TS391A |
| RoHS Status |
RoHS non-compliant |
| Moisture Sensitivity Level (MSL) |
Not Applicable |
| REACH Status |
REACH Affected |
| ECCN |
EAR99 |
| HTSUS |
3810.10.0000 |
| Standard Package |
1 |
Leaded No-Clean Solder Paste Sn63Pb37 (63/37) Jar, 1.76 oz (50g)