Parameters |
Mfr |
Chip Quik Inc. |
Series |
- |
Package |
Bulk |
Product Status |
Active |
Type |
Wire Solder |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter |
0.015" (0.38mm) |
Melting Point |
423 ~ 428°F (217 ~ 220°C) |
Flux Type |
No-Clean, Water Soluble |
Wire Gauge |
27 AWG, 28 SWG |
Process |
Lead Free |
Form |
Spool, 8 oz (227g), 1/2 lb |
Shelf Life |
- |
Shelf Life Start |
- |
Storage/Refrigeration Temperature |
- |
Digi-Key Storage |
- |
Shipping Info |
- |
Base Product Number |
SMDSW |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8311.30.6000 |
Standard Package |
1 |
Lead Free No-Clean, Water Soluble Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 27 AWG, 28 SWG Spool, 8 oz (227g), 1/2 lb