NXP USA Inc. LPC2119FBD64,151

LPC2119FBD64,151

Manufacturer: NXP USA Inc.
Manufacturer's number: NXP USA Inc. LPC2119FBD64,151
Package: Tray
Datasheet: PDF
Stock: 3031
SKU: LPC2119FBD64,151
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Details

Parameters
Mfr	NXP USA Inc.
Series	LPC2100
Package	Tray
Product Status	Obsolete
Core Processor	ARM7®
Core Size	16/32-Bit
Speed	60MHz
Connectivity	CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals	POR, PWM, WDT
Number of I/O	46
Program Memory Size	128KB (128K x 8)
Program Memory Type	FLASH
EEPROM Size	-
RAM Size	16K x 8
Voltage - Supply (Vcc/Vdd)	1.65V ~ 3.6V
Data Converters	A/D 4x10b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	64-LQFP
Supplier Device Package	64-LQFP (10x10)
Base Product Number	LPC2119
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	3A991A2
HTSUS	8542.31.0001
Standard Package	160

ARM7® LPC2100 Microcontroller IC 16/32-Bit 60MHz 128KB (128K x 8) FLASH 64-LQFP (10x10)