| Parameters |
| Mfr |
Aries Electronics |
| Series |
55 |
| Package |
Bulk |
| Product Status |
Active |
| Type |
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) |
28 (2 x 14) |
| Pitch - Mating |
0.100" (2.54mm) |
| Contact Finish - Mating |
Tin |
| Contact Finish Thickness - Mating |
200.0µin (5.08µm) |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Through Hole |
| Features |
Closed Frame |
| Termination |
Solder |
| Pitch - Post |
0.100" (2.54mm) |
| Contact Finish - Post |
Tin |
| Contact Finish Thickness - Post |
200.0µin (5.08µm) |
| Contact Material - Post |
Beryllium Copper |
| Housing Material |
Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature |
-65°C ~ 105°C |
| Termination Post Length |
0.110" (2.78mm) |
| Material Flammability Rating |
UL94 V-0 |
| Current Rating (Amps) |
1 A |
| Contact Resistance |
- |
| Base Product Number |
28-3554 |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8536.69.4040 |
| Other Names |
Q6708658 |
| Standard Package |
9 |
28 (2 x 14) Pos DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Socket Tin Through Hole