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EDSYN INCORPORATED TSX713
REFLOW VACUUM TIP, HOLE DIA: 1.3
- Manufacturer: EDSYN INCORPORATED
- Manufacturer's number: EDSYN INCORPORATED TSX713
- Package: Bag
- Datasheet: -
- Stock: 5
- SKU: TSX713
| Parameters | |
|---|---|
| Mfr | EDSYN INCORPORATED |
| Series | SOLDAVAC® |
| Package | Bag |
| Product Status | Active |
| Tip Type | Rework |
| Tip Shape | Nozzle |
| Height | - |
| Width | - |
| Length | 0.551" (14.00mm) |
| Diameter | 0.051" (1.30mm) |
| Tip Chip Size | - |
| Temperature Range | - |
| For Use With/Related Products | - |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| ECCN | EAR99 |
| HTSUS | 8515.90.9000 |
| Other Names | 2590-TSX713 |
| Standard Package | 1 |
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