| Parameters |
| Mfr |
Chip Quik Inc. |
| Series |
CHIPQUIK® SMD4300 |
| Package |
Jar |
| Product Status |
Active |
| Type |
Solder Paste |
| Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter |
- |
| Melting Point |
423 ~ 428°F (217 ~ 220°C) |
| Flux Type |
No-Clean, Water Soluble |
| Wire Gauge |
- |
| Mesh Type |
3 |
| Process |
Lead Free |
| Form |
Jar, 8.8 oz (250g) |
| Shelf Life |
6 Months |
| Shelf Life Start |
Date of Manufacture |
| Storage/Refrigeration Temperature |
37°F ~ 46°F (3°C ~ 8°C) |
| Digi-Key Storage |
Refrigerated |
| Shipping Info |
Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. |
| Weight |
0.551 lb (249.93 g) |
| Base Product Number |
SMD4300 |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
Not Applicable |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8311.30.6000 |
| Standard Package |
1 |
Lead Free No-Clean, Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)