Chip Quik Inc. SMD291SNL250T3

SOLDER PASTE SAC305 250G T3

Quantity:

Add to Cart

Unit Price: $54.9500

Ext Price: $54.9500

Details

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 8.8 oz (250g)

Parameters
Mfr	Chip Quik Inc.
Series	-
Package	Jar
Product Status	Active
Type	Solder Paste
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	-
Melting Point	423 ~ 428°F (217 ~ 220°C)
Flux Type	No-Clean
Wire Gauge	-
Mesh Type	3
Process	Lead Free
Form	Jar, 8.8 oz (250g)
Shelf Life	6 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)
Digi-Key Storage	Refrigerated
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Weight	0.551 lb (249.93 g)
Base Product Number	SMD291
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	Not Applicable
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8311.30.6000
Standard Package	1