| Parameters |
| Mfr |
Chip Quik Inc. |
| Series |
SMD2 |
| Package |
Bulk |
| Product Status |
Active |
| Type |
Solder Sphere |
| Composition |
Sn63Pb37 (63/37) |
| Diameter |
0.012" (0.31mm) |
| Melting Point |
361°F (183°C) |
| Flux Type |
- |
| Wire Gauge |
- |
| Process |
Leaded |
| Form |
Jar |
| Shelf Life |
24 Months |
| Shelf Life Start |
Date of Manufacture |
| Storage/Refrigeration Temperature |
- |
| Digi-Key Storage |
- |
| RoHS Status |
RoHS non-compliant |
| Moisture Sensitivity Level (MSL) |
Not Applicable |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8311.30.3000 |
| Standard Package |
1 |
Leaded Solder Sphere Sn63Pb37 (63/37) Jar