NXP USA Inc. MC9S12B64MPVE

MC9S12B64MPVE

Manufacturer: NXP USA Inc.
Manufacturer's number: NXP USA Inc. MC9S12B64MPVE
Package: Tray
Datasheet: PDF
Stock: 4778
SKU: MC9S12B64MPVE
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Details

Parameters
Speed	25MHz
Connectivity	CANbus, I²C, SCI, SPI
Peripherals	POR, PWM, WDT
Number of I/O	91
Program Memory Size	64KB (64K x 8)
Program Memory Type	FLASH
EEPROM Size	1K x 8
RAM Size	2K x 8
Voltage - Supply (Vcc/Vdd)	2.35V ~ 5.5V
Data Converters	A/D 16x10b
Oscillator Type	Internal
Operating Temperature	-40°C ~ 125°C (TA)
Mounting Type	Surface Mount
Package / Case	112-LQFP
Supplier Device Package	112-LQFP (20x20)
Base Product Number	MC9S12
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	3 (168 Hours)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8542.31.0001
Other Names	935319152557
Standard Package	300
Mfr	NXP USA Inc.
Series	HCS12
Package	Tray
Product Status	Not For New Designs
Core Processor	HCS12
Core Size	16-Bit

HCS12 HCS12 Microcontroller IC 16-Bit 25MHz 64KB (64K x 8) FLASH 112-LQFP (20x20)