CUI Devices HSS08-B18-CP

HEAT SINK, STAMPING, TO-218, 44.

Manufacturer: CUI Devices
Manufacturer's number: CUI Devices HSS08-B18-CP
Package: Box
Datasheet: PDF
Stock: 988
SKU: HSS08-B18-CP
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Details

Parameters
Mfr	CUI Devices
Series	HSS
Package	Box
Product Status	Active
Type	Board Level, Vertical
Package Cooled	TO-218
Attachment Method	PC Pin
Shape	Square
Length	1.750" (44.45mm)
Width	1.750" (44.45mm)
Diameter	-
Fin Height	0.492" (12.50mm)
Power Dissipation @ Temperature Rise	10.3W @ 75°C
Thermal Resistance @ Forced Air Flow	3.50°C/W @ 200 LFM
Thermal Resistance @ Natural	7.29°C/W
Material	Aluminum Alloy
Material Finish	Black Anodized
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	Not Applicable
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8473.30.5100
Other Names	2223-HSS08-B18-CP
Standard Package	1,000

Heat Sink TO-218 Aluminum Alloy 10.3W @ 75°C Board Level, Vertical