CUI Devices HSS02-B20-P318

HEAT SINK, STAMPING, TO-220, 23.

Manufacturer: CUI Devices
Manufacturer's number: CUI Devices HSS02-B20-P318
Package: Box
Datasheet: PDF
Stock: 1
SKU: HSS02-B20-P318
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Details

Parameters
Material	Aluminum Alloy
Material Finish	Black Anodized
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	Not Applicable
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8473.30.5100
Other Names	2223-HSS02-B20-P318
Standard Package	1,760
Mfr	CUI Devices
Series	HSS
Package	Box
Product Status	Active
Type	Board Level, Vertical
Package Cooled	TO-220
Attachment Method	Bolt On and PC Pin
Shape	Rectangular
Length	1.900" (48.26mm)
Width	0.930" (23.62mm)
Diameter	-
Fin Height	0.950" (24.13mm)
Power Dissipation @ Temperature Rise	6.9W @ 75°C
Thermal Resistance @ Forced Air Flow	4.80°C/W @ 200 LFM
Thermal Resistance @ Natural	10.90°C/W

Heat Sink TO-220 Aluminum Alloy 6.9W @ 75°C Board Level, Vertical