CUI Devices HSB07-202009
HEAT SINK, BGA, 20 X 20 X 9 MM
- Manufacturer: CUI Devices
- Manufacturer's number: CUI Devices HSB07-202009
- Package: Box
- Datasheet: PDF
- Stock: 1
- SKU: HSB07-202009
- Pricing:we created an exceptionally flexible and competitive pricing policy.
| Parameters | |
|---|---|
| Mfr | CUI Devices |
| Series | HSB |
| Package | Box |
| Product Status | Active |
| Type | Top Mount |
| Package Cooled | BGA |
| Attachment Method | Adhesive |
| Shape | Square, Pin Fins |
| Length | 0.787" (20.00mm) |
| Width | 0.787" (20.00mm) |
| Diameter | - |
| Fin Height | 0.354" (9.00mm) |
| Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 8.60°C/W @ 200 LFM |
| Thermal Resistance @ Natural | 24.08°C/W |
| Material | Aluminum Alloy |
| Material Finish | Black Anodized |
| RoHS Status | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| REACH Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8473.30.5100 |
| Other Names | 2223-HSB07-202009 |
| Standard Package | 1,872 |
Heat Sink BGA Aluminum Alloy 3.1W @ 75°C Top Mount
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