CUI Devices HSB01-080808

HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

Manufacturer: CUI Devices
Manufacturer's number: CUI Devices HSB01-080808
Package: Box
Datasheet: PDF
Stock: 1
SKU: HSB01-080808
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Unit Price: $0.7300

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Details

Parameters
Mfr	CUI Devices
Series	HSB
Package	Box
Product Status	Active
Type	Top Mount
Package Cooled	BGA
Attachment Method	Adhesive (Not Included)
Shape	Square, Pin Fins
Length	0.335" (8.50mm)
Width	0.335" (8.50mm)
Diameter	-
Fin Height	0.315" (8.00mm)
Power Dissipation @ Temperature Rise	1.9W @ 75°C
Thermal Resistance @ Forced Air Flow	16.00°C/W @ 200 LFM
Thermal Resistance @ Natural	39.10°C/W
Material	Aluminum Alloy
Material Finish	Black Anodized
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	Not Applicable
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8473.30.5100
Other Names	2223-HSB01-080808
Standard Package	3,672