| Parameters |
| Mfr |
Chip Quik Inc. |
| Series |
CHIPQUIK® |
| Package |
Bulk |
| Product Status |
Active |
| Type |
Solder Paste |
| Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter |
- |
| Melting Point |
423°F (217°C) |
| Flux Type |
Water Soluble |
| Wire Gauge |
- |
| Mesh Type |
4 |
| Process |
Lead Free |
| Form |
Jar, 17.64 oz (500g) |
| Shelf Life |
6 Months |
| Shelf Life Start |
Date of Manufacture |
| Base Product Number |
WS991 |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8311.30.6000 |
| Other Names |
315-WS991SNL500T4 |
| Standard Package |
1 |
Lead Free Water Soluble Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)