Parameters | |
---|---|
Mfr | Chip Quik Inc. |
Series | CHIPQUIK® |
Package | Bulk |
Product Status | Active |
Type | Solder Paste |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Melting Point | 423°F (217°C) |
Flux Type | Water Soluble |
Wire Gauge | - |
Mesh Type | 4 |
Process | Lead Free |
Form | Jar, 17.64 oz (500g) |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Base Product Number | WS991 |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 8311.30.6000 |
Other Names | 315-WS991SNL500T4 |
Standard Package | 1 |
Please send RFQ, we will respond immediately.