Chip Quik Inc. TS991SNL500T4

SOLDER PASTE THERMALLY STABLE NC

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Unit Price: $97.0900

Ext Price: $97.0900

Details

Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)

Parameters
Base Product Number	TS991S
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	3810.10.0000
Other Names	315-TS991SNL500T4
Standard Package	1
Mfr	Chip Quik Inc.
Series	CHIPQUIK®
Package	Bulk
Product Status	Active
Type	Solder Paste
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter	-
Melting Point	423°F (217°C)
Flux Type	No-Clean
Wire Gauge	-
Mesh Type	4
Process	Lead Free
Form	Jar, 17.64 oz (500g)
Shelf Life	12 Months
Shelf Life Start	Date of Manufacture