Parameters |
Mfr |
Chip Quik Inc. |
Series |
CHIPQUIK® |
Package |
Bulk |
Product Status |
Active |
Type |
Solder Paste |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter |
- |
Melting Point |
423°F (217°C) |
Flux Type |
No-Clean |
Wire Gauge |
- |
Mesh Type |
3 |
Process |
Lead Free |
Form |
Jar, 17.64 oz (500g) |
Shelf Life |
12 Months |
Shelf Life Start |
Date of Manufacture |
Base Product Number |
TS991S |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
3810.10.0000 |
Other Names |
315-TS991SNL500T3 |
Standard Package |
1 |
Lead Free No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 17.64 oz (500g)