Parameters |
Mfr |
Chip Quik Inc. |
Series |
- |
Package |
Bulk |
Product Status |
Active |
Type |
Solder Paste |
Composition |
Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter |
- |
Melting Point |
280°F (138°C) |
Flux Type |
No-Clean |
Wire Gauge |
- |
Process |
Lead Free |
Form |
Jar, 8.8 oz (250g) |
Shelf Life |
6 Months |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
32°F ~ 77°F (0°C ~ 25°C) |
Shipping Info |
- |
Weight |
- |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
3810.10.0000 |
Standard Package |
1 |
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)