Parameters |
Mfr |
Chip Quik Inc. |
Series |
SMD2 |
Package |
Bulk |
Product Status |
Active |
Type |
Wire Solder |
Composition |
Bi57.6Sn42Ag0.4 (57.6/42/0.4) |
Diameter |
0.040" (1.02mm) |
Melting Point |
280°F (138°C) |
Flux Type |
No-Clean, Rosin Activated (RA) |
Wire Gauge |
- |
Process |
Lead Free |
Form |
Spool, 1.8 oz (50g) |
Shelf Life |
- |
Shelf Life Start |
- |
Storage/Refrigeration Temperature |
- |
Base Product Number |
SMD2S |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8311.30.6000 |
Other Names |
315-SMD2SWLT.04050G |
Standard Package |
1 |
Lead Free No-Clean, Rosin Activated (RA) Wire Solder Bi57.6Sn42Ag0.4 (57.6/42/0.4) Spool, 1.8 oz (50g)