| Parameters |
| Mfr |
Chip Quik Inc. |
| Series |
- |
| Package |
Bulk |
| Product Status |
Active |
| Type |
Solder Paste |
| Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter |
- |
| Melting Point |
423 ~ 428°F (217 ~ 220°C) |
| Flux Type |
No-Clean |
| Wire Gauge |
- |
| Mesh Type |
7 |
| Process |
- |
| Form |
Jar, 1.41 oz (40g) |
| Shelf Life |
6 Months |
| Shelf Life Start |
Date of Manufacture |
| Storage/Refrigeration Temperature |
37°F ~ 46°F (3°C ~ 8°C) |
| Base Product Number |
SMD291 |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
3810.10.0000 |
| Other Names |
315-SMD291SNL40T7 |
| Standard Package |
1 |
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.41 oz (40g)