Parameters |
Mfr |
Chip Quik Inc. |
Series |
- |
Package |
Bulk |
Product Status |
Active |
Type |
Solder Paste |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter |
- |
Melting Point |
423 ~ 428°F (217 ~ 220°C) |
Flux Type |
No-Clean |
Wire Gauge |
- |
Mesh Type |
7 |
Process |
- |
Form |
Jar, 1.41 oz (40g) |
Shelf Life |
6 Months |
Shelf Life Start |
Date of Manufacture |
Storage/Refrigeration Temperature |
37°F ~ 46°F (3°C ~ 8°C) |
Base Product Number |
SMD291 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
3810.10.0000 |
Other Names |
315-SMD291SNL40T7 |
Standard Package |
1 |
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 1.41 oz (40g)