Parameters | |
---|---|
Mfr | Chip Quik Inc. |
Series | - |
Package | Bulk |
Product Status | Active |
Type | Wire Solder |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | 0.031" (0.79mm) |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Flux Type | No-Clean |
Wire Gauge | 20 AWG, 21 SWG |
Process | - |
Form | Tube, 0.50 oz (14.17g) |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Base Product Number | NCSW |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 8311.30.6000 |
Other Names | 315-NCSWLF.0310.5OZ |
Standard Package | 1 |
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