| Parameters |
| Mfr |
Chip Quik Inc. |
| Series |
- |
| Package |
Bulk |
| Product Status |
Active |
| Type |
Wire Solder |
| Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Diameter |
0.020" (0.51mm) |
| Melting Point |
423 ~ 428°F (217 ~ 220°C) |
| Flux Type |
No-Clean |
| Wire Gauge |
24 AWG, 25 SWG |
| Process |
- |
| Form |
Tube, 0.3 oz (8.51g) |
| Shelf Life |
- |
| Shelf Life Start |
- |
| Storage/Refrigeration Temperature |
- |
| Base Product Number |
NCSW |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
REACH Unaffected |
| ECCN |
EAR99 |
| HTSUS |
8311.30.6000 |
| Other Names |
315-NCSWLF.0200.3OZ |
| Standard Package |
1 |
No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Tube, 0.3 oz (8.51g)