Parameters |
Mfr |
Chip Quik Inc. |
Series |
- |
Package |
Bulk |
Product Status |
Active |
Type |
Wire Solder |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter |
0.020" (0.51mm) |
Melting Point |
423 ~ 428°F (217 ~ 220°C) |
Flux Type |
No-Clean |
Wire Gauge |
24 AWG, 25 SWG |
Process |
- |
Form |
Tube, 0.3 oz (8.51g) |
Shelf Life |
- |
Shelf Life Start |
- |
Storage/Refrigeration Temperature |
- |
Base Product Number |
NCSW |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8311.30.6000 |
Other Names |
315-NCSWLF.0200.3OZ |
Standard Package |
1 |
No-Clean Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Tube, 0.3 oz (8.51g)