Parameters | |
---|---|
Mfr | Chip Quik Inc. |
Series | - |
Package | Bulk |
Product Status | Active |
Type | Wire Solder |
Composition | Sn63Pb37 (63/37) |
Diameter | 0.020" (0.51mm) |
Melting Point | 361°F (183°C) |
Flux Type | No-Clean |
Wire Gauge | 24 AWG, 25 SWG |
Process | Leaded |
Form | Tube, 0.3 oz (8.51g) |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Base Product Number | NCSW |
RoHS Status | RoHS non-compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
REACH Status | REACH Affected |
ECCN | EAR99 |
HTSUS | 8311.30.3000 |
Other Names | 315-NCSW.0200.3OZ |
Standard Package | 1 |
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