| Parameters |
| Mfr |
Chip Quik Inc. |
| Series |
- |
| Package |
Bulk |
| Product Status |
Active |
| Type |
Wire Solder |
| Composition |
Pb93.5Sn5Ag1.5 (93.5/5/1.5) |
| Diameter |
0.031" (0.79mm) |
| Melting Point |
565 ~ 574°F (296 ~ 301°C) |
| Flux Type |
No-Clean |
| Wire Gauge |
20 AWG, 21 SWG |
| Process |
Leaded |
| Form |
Tube, 0.50 oz (14.17g) |
| Shelf Life |
- |
| Shelf Life Start |
- |
| Storage/Refrigeration Temperature |
- |
| Base Product Number |
NC4SW |
| RoHS Status |
RoHS non-compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
REACH Affected |
| ECCN |
EAR99 |
| HTSUS |
8311.30.6000 |
| Other Names |
315-NC4SW.0310.5OZ |
| Standard Package |
1 |
Leaded No-Clean Wire Solder Pb93.5Sn5Ag1.5 (93.5/5/1.5) 20 AWG, 21 SWG Tube, 0.50 oz (14.17g)