Parameters |
Mfr |
Chip Quik Inc. |
Series |
- |
Package |
Bulk |
Product Status |
Active |
Type |
Wire Solder |
Composition |
Sn96.5Ag3.5 (96.5/3.5) |
Diameter |
0.031" (0.79mm) |
Melting Point |
430°F (221°C) |
Flux Type |
No-Clean |
Wire Gauge |
20 AWG, 21 SWG |
Process |
- |
Form |
Tube, 0.50 oz (14.17g) |
Shelf Life |
- |
Shelf Life Start |
- |
Storage/Refrigeration Temperature |
- |
Base Product Number |
NC3SW |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8311.30.6000 |
Other Names |
315-NC3SWLF.0310.5OZ |
Standard Package |
1 |
No-Clean Wire Solder Sn96.5Ag3.5 (96.5/3.5) 20 AWG, 21 SWG Tube, 0.50 oz (14.17g)