Parameters |
Mfr |
Chip Quik Inc. |
Series |
- |
Package |
Bulk |
Product Status |
Active |
Type |
Wire Solder |
Composition |
Sn62Pb36Ag2 (62/36/2) |
Diameter |
0.020" (0.51mm) |
Melting Point |
354°F (179°C) |
Flux Type |
No-Clean |
Wire Gauge |
24 AWG, 25 SWG |
Process |
Leaded |
Form |
Tube, 0.3 oz (8.51g) |
Shelf Life |
- |
Shelf Life Start |
- |
Storage/Refrigeration Temperature |
- |
Base Product Number |
NC3SW |
RoHS Status |
RoHS non-compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Affected |
ECCN |
EAR99 |
HTSUS |
8311.30.3000 |
Other Names |
315-NC3SW.0200.3OZ |
Standard Package |
1 |
Leaded No-Clean Wire Solder Sn62Pb36Ag2 (62/36/2) 24 AWG, 25 SWG Tube, 0.3 oz (8.51g)