Parameters | |
---|---|
Mfr | Chip Quik Inc. |
Series | Smooth Flow™ |
Package | Bulk |
Product Status | Active |
Type | Solder Paste |
Composition | Bi57Sn42Ag1 (57/42/1) |
Diameter | - |
Melting Point | 279°F (137°C) |
Flux Type | No-Clean |
Wire Gauge | - |
Mesh Type | 4 |
Process | - |
Form | Jar, 8.8 oz (250g) |
Shelf Life | 12 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 37°F ~ 46°F (3°C ~ 8°C) |
Base Product Number | NC191 |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 3810.10.0000 |
Other Names | 315-NC191LTA250 |
Standard Package | 1 |
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