Parameters | |
---|---|
Mfr | Chip Quik Inc. |
Series | Super Low Dross™ |
Package | Bulk |
Product Status | Active |
Type | Bar Solder |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter | - |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Flux Type | - |
Wire Gauge | - |
Process | Leaded |
Form | Bar, 0.5 lb (227g) |
Shelf Life | - |
Shelf Life Start | - |
Storage/Refrigeration Temperature | - |
Base Product Number | EXB-SN96 |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
REACH Status | REACH Unaffected |
ECCN | EAR99 |
HTSUS | 8311.90.0000 |
Other Names | 315-EXB-SN96.5AG3.0CU0.5-0.5LB |
Standard Package | 1 |
Please send RFQ, we will respond immediately.