Parameters |
Mfr |
Chip Quik Inc. |
Series |
Super Low Dross™ |
Package |
Bulk |
Product Status |
Active |
Type |
Bar Solder |
Composition |
Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Diameter |
- |
Melting Point |
423 ~ 428°F (217 ~ 220°C) |
Flux Type |
- |
Wire Gauge |
- |
Process |
Leaded |
Form |
Bar, 0.5 lb (227g) |
Shelf Life |
- |
Shelf Life Start |
- |
Storage/Refrigeration Temperature |
- |
Base Product Number |
EXB-SN96 |
RoHS Status |
ROHS3 Compliant |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
REACH Status |
REACH Unaffected |
ECCN |
EAR99 |
HTSUS |
8311.90.0000 |
Other Names |
315-EXB-SN96.5AG3.0CU0.5-0.5LB |
Standard Package |
1 |
Leaded Bar Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) Bar, 0.5 lb (227g)