
| Parameters | |
|---|---|
| Mfr | Chip Quik Inc. |
| Series | CHIPQUIK® |
| Package | Bulk |
| Product Status | Obsolete |
| Type | Epoxy |
| Features | Heat Cure |
| For Use With/Related Products | PCB |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| ECCN | OBSOLETE |
| Other Names | 315-AD1-200S |
| Standard Package | 1 |

