Parameters | |
---|---|
Mfr | Chip Quik Inc. |
Series | CHIPQUIK® |
Package | Bulk |
Product Status | Obsolete |
Type | Epoxy |
Features | Heat Cure |
For Use With/Related Products | PCB |
Moisture Sensitivity Level (MSL) | Not Applicable |
ECCN | OBSOLETE |
Other Names | 315-AD1-200S |
Standard Package | 1 |