Parameters | |
---|---|
Mfr | Canfield Technologies |
Series | - |
Package | Spool |
Product Status | Active |
Type | Wire Solder |
Composition | BLF 227 (99.17Sn/.8Cu/.03Ni) |
Diameter | 0.020" (0.51mm) |
Melting Point | 440°F (227°C) |
Flux Type | Rosin Activated (RA) |
Wire Gauge | 24 AWG, 25 SWG |
Process | Lead Free |
Form | Spool, 1 lb (453.59g) |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Storage/Refrigeration Temperature | 50°F ~ 104°F (10°C ~ 40°C) |
RoHS Status | ROHS3 Compliant |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
REACH Status | REACH Unaffected |
Other Names | 3844-RCBLF22701020P |
Standard Package | 1 |
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