Canfield Technologies CCBLF227L2020

BLF 227 NO CLEAN FLUX 8 OZ .020

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Unit Price: $40.8400

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Details

Lead Free No-Clean Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 24 AWG, 25 SWG Spool, 8 oz (227g), 1/2 lb

Parameters
Mfr	Canfield Technologies
Series	-
Package	Spool
Product Status	Active
Type	Wire Solder
Composition	BLF 227 (99.17Sn/.8Cu/.03Ni)
Diameter	0.020" (0.51mm)
Melting Point	440°F (227°C)
Flux Type	No-Clean
Wire Gauge	24 AWG, 25 SWG
Process	Lead Free
Form	Spool, 8 oz (227g), 1/2 lb
Shelf Life	24 Months
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	50°F ~ 104°F (10°C ~ 40°C)
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
Other Names	3844-CCBLF227L2020
Standard Package	1