| Parameters |
| Mfr |
Canfield Technologies |
| Series |
- |
| Package |
Spool |
| Product Status |
Active |
| Type |
Wire Solder |
| Composition |
BLF 227 (99.17Sn/.8Cu/.03Ni) |
| Diameter |
0.020" (0.51mm) |
| Melting Point |
440°F (227°C) |
| Flux Type |
No-Clean |
| Wire Gauge |
24 AWG, 25 SWG |
| Process |
Lead Free |
| Form |
Spool, 8 oz (227g), 1/2 lb |
| Shelf Life |
24 Months |
| Shelf Life Start |
Date of Manufacture |
| Storage/Refrigeration Temperature |
50°F ~ 104°F (10°C ~ 40°C) |
| RoHS Status |
ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
| REACH Status |
REACH Unaffected |
| Other Names |
3844-CCBLF227L2020 |
| Standard Package |
1 |
Lead Free No-Clean Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 24 AWG, 25 SWG Spool, 8 oz (227g), 1/2 lb