Canfield Technologies CCBLF22701062 - Canfield Technologies Solder - BOM, Chip Distributor, Quick Quotation 365day Warranty
product_banner

Canfield Technologies CCBLF22701062

BLF 227 NO CLEAN 1 LB. 062 CORE

  • Manufacturer: Canfield Technologies
  • Manufacturer's number: Canfield Technologies CCBLF22701062
  • Package: Spool
  • Datasheet: -
  • Stock: 100
  • SKU: CCBLF22701062
  • Pricing:we created an exceptionally flexible and competitive pricing policy.

Quantity:

Unit Price: $86.3300

Ext Price: $86.3300

Details

Tags

Parameters
Mfr Canfield Technologies
Series -
Package Spool
Product Status Active
Type Wire Solder
Composition BLF 227 (99.17Sn/.8Cu/.03Ni)
Diameter 0.062" (1.57mm)
Melting Point 440°F (227°C)
Flux Type No-Clean
Wire Gauge 14 AWG, 16 SWG
Process Lead Free
Form Spool, 1 lb (453.59g)
Shelf Life 24 Months
Shelf Life Start Date of Manufacture
Storage/Refrigeration Temperature 50°F ~ 104°F (10°C ~ 40°C)
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
Standard Package 1
Lead Free No-Clean Wire Solder BLF 227 (99.17Sn/.8Cu/.03Ni) 14 AWG, 16 SWG Spool, 1 lb (453.59g)