Aries Electronics 18-3518-10

CONN IC DIP SOCKET 18POS GOLD

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Details

18 (2 x 9) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole

Parameters
Mfr	Aries Electronics
Series	518
Package	Bulk
Product Status	Active
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	18 (2 x 9)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10.0µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Tin
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-
Termination Post Length	0.125" (3.18mm)
Material Flammability Rating	UL94 V-0
Current Rating (Amps)	3 A
Contact Resistance	-
Base Product Number	18-3518
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
REACH Status	REACH Unaffected
ECCN	EAR99
HTSUS	8536.69.4040
Standard Package	21